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1 метод перевернутого кристалла
flip chip, flip-flop микр., flip-chip method, flip-chip process, face-down technique, flip-chip technique, inverted mounted technique, die-upsetРусско-английский словарь по электронике > метод перевернутого кристалла
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2 метод перевернутого кристалла
flip chip, flip-flop микр., flip-chip method, flip-chip process, face-down technique, flip-chip technique, inverted mounted technique, die-upsetРусско-английский словарь по радиоэлектронике > метод перевернутого кристалла
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3 метод перевёрнутого кристалла
1) Engineering: face-down technique (в микроэлектронике), flip-chip method (в микроэлектронике), flip-chip technique (в микроэлектронике), flip-flop (в микроэлектронике)2) Electronics: face-down technique, flip-chip approach, flip-chip process, flip-chip technique, inverted mounted technique3) Information technology: flipchip technique4) Household appliances: flip chip5) Microelectronics: flip-over processУниверсальный русско-английский словарь > метод перевёрнутого кристалла
См. также в других словарях:
Flip chip — Flip chip, also known as Controlled Collapse Chip Connection or its acronym, C4, is a method for interconnecting semiconductor devices, such as IC chips and MEMS, to external circuitry with solder bumps that have been deposited onto the chip pads … Wikipedia
Flip-chip pin grid array — (FC PGA or FCPGA) is a form of pin grid array processor architecture package in which the die faces downwards on the top of the CPU with the back of the die exposed. This allows the die to have a more direct contact with the heatsink or other… … Wikipedia
Chip tridimensional (3D) — En electrónica, un circuito integrado tridimensional, o simplemente chip tridimensional (chip 3D), es un chip compuesto por dos o más capas de componentes electrónicos activos, integrados tanto vertical como horizontalmente, y formando un único… … Wikipedia Español
Chip tricks — are manipulations of poker chips. Unlike in magic, chip tricks are not demonstrated to fool a spectator. Rather, in the poker community, chip tricks are a way of passing time, fidgeting, showing off, looking impressive or intimidating other… … Wikipedia
Thermal copper pillar bump — The Thermal Copper Pillar Bump, also known as the thermal bump , is a thermoelectric device made from thin film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and… … Wikipedia
Integrated circuit — Silicon chip redirects here. For the electronics magazine, see Silicon Chip. Integrated circuit from an EPROM memory microchip showing the memory blocks, the supporting circuitry and the fine silver wires which connect the integrated circuit die… … Wikipedia
List of Intel microprocessors — For a list of Intel s microcontrollers, see List of common microcontrollers#Intel. This generational and chronological list of Intel microprocessors attempts to present all of Intel s processors from the pioneering 4 bit 4004 (1971) to the… … Wikipedia
Digital Equipment Corporation — Industry Computer manufacturing Fate Assets were sold to various companies. What remained was sold to Compaq. Successor … Wikipedia
Field-programmable gate array — FPGAs should not be confused with the flip chip pin grid array, a form of integrated circuit packaging. A field programmable gate array is a semiconductor device containing programmable logic components called logic blocks , and programmable… … Wikipedia
Radeon R300 — ATIGPU name = Radeon 9500 X600 Series codename = Khan created = 2002 entry = Radeon 9550, X300 midrange = Radeon 9500, 9600, X550, X600 highend = Radeon 9700, 9800 d3dversion = 9.0, Shader Model 2.0The Radeon R300 (introduced August 2002) is the… … Wikipedia
AMD 700 chipset series — AMD chipsets Table name = AMD 700 chipset series/ AMD 7 Series Chipsets img w = 100px Codename = Wahoo (790FX, Quad FX) Hammerhead (790FX) Seahorse (780G) CPU = Phenom series Athlon 64 series Sempron series Socket = Socket F+/F (790FX/DSDC)… … Wikipedia
